The latest version is now available for free.Īmazon Web Services (AWS) unveiled the next generations of its own chip designs, the Graviton and Trainium chips. rights holders protect their IP rights in China. Patent and Trademark Office ( USPTO) updated its China intellectual property (IP) rights guide to help U.S. The OMG Systems Modeling Community (SMC) will be one of the first communities launched. The goal is to offer a competitive advantage to participants in the form of learning about best practices and future technologies. Object Management Group announced a Managed Communities Program in which members can network and participate in the development of community products. The facility is part of AMD’s plans to invest $400 million in India over the next five years. The facility spans 500,000 square feet and will employ around 3,000 engineers to design and develop semiconductor technology, including 3D-ICs and AI/ML. 1, 2024, or until it accepts 1,000 grantable petitions.ĪMD debuted its largest global design center, named AMD Technostar, in Bengaluru, India. Patent & Trade Office, which has been criticized for the amount of time it takes to review patents, introduced a new Semiconductor Technology Pilot Program as part of CHIPS for America to fast track semiconductor patents. The GenAI will be able to offer expert tool guidance generative capabilities for RTL, verification, and other collateral creation and autonomous capabilities for workflow creation from natural language. The company reports that collaborations with AMD, Intel, and Microsoft already have shown good results. Synopsys plans to add generative AI (GenAI) capabilities across the full stack of its Synopsys.ai EDA suite. The first phase of the construction is expected to be completed and operational within two to three years. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.By Susan Rambo, Gregory Haley, and Liz AllanĪmkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. The use of the word “partner” does not imply a legal partnership between Lattice and any other entity. Lattice Semiconductor Corporation, Lattice Semiconductor (& design), and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries. Our technology, long-standing relationships, and commitment to world-class support let our customers quickly and easily unleash their innovation to create a smart, secure, and connected world.įor more information about Lattice, please visit You can also follow us via LinkedIn, Twitter, Facebook, YouTube, WeChat, or Weibo. We solve customer problems across the network, from the Edge to the Cloud, in the growing Communications, Computing, Industrial, Automotive, and Consumer markets. Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. įor more information about and to register for the conference, visit 2023 OCP Global Summit. The Open Compute Project (OCP) Summit is the largest gathering of technologists looking to apply the benefits of open source and open collaboration to hardware and software, and rapidly increase the pace of innovation in, near, and around the datacenter and beyond.įor more information about Lattice, please visit. OCP Global Summit, San Jose Convention Center, California PDT: DC-SCM (Datacenter Secure Control Module Specification) - 2.0 LTPI Interoperability PDT: Leveraging FPGA-based root of trust for efficient, dynamic, and remote platform attestation LTPI (Low voltage differential signaling Tunneling Protocol and Interface) and PFR (Platform Firmware Resiliency) solution in a single chipĭC-MHS (Datacenter – Modular Hardware System) FPGA server fan control solutionĮngineering Workshop Presentations: Oct. Lattice will showcase its latest FPGA technology innovations with a demo showcase and engineering workshop presentations. HILLSBORO, Ore.-( BUSINESS WIRE)- Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced its participation in the 2023 OCP Global Summit taking place at the San Jose Convention Center Oct.
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